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ME-IO 18,8/28 TBUS DEV-PCB 2202548 PHOENIX CONTACT PCB
ME-IO 18,8/28 TBUS DEV-PCB
2202548
PHOENIX CONTACT
1 Pcs.
PCB
Perforated weft plate for the ME-IO 18.8 DEV-KIT; for HSCH 2.5 base housing; Suitable for manual welding
Perfboard for the ME-IO 18,8 DEV-KIT; for HSCH 2,5 header; ideal for manual soldering
Automation > Electronic enclosure
Housing (HS)
Product condition, packaging, certifications and applicable manufacturer warranty terms are confirmed with the quotation.
More info
▲Technical data
Product properties
| Product type | PCB |
| Housing type | DIN rail housing |
| Housing series | ME-IO |
| Product family | ME-IO |
| Max. number of positions | 28 (pitch: 5 mm) |
Dimensions
| Width | 1.6 mm |
| Height | 98.2 mm |
| Depth | 66.8 mm |
| PCB design | |
| PCB thickness | 1.4 mm ... 1.8 mm |
Material specifications
| Color | green |
| Housing material | FR 4-21 |
Environmental and real-life conditions
| Ambient conditions | |
| Ambient temperature (operation) | 110 °C (depending on power dissipation) |
PCB data
| Thickness of the PCB | 1.4 mm ... 1.8 mm |