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DFK-MSTBA 2,5/ 4-GF-5,08 BK
1021711
PHOENIX CONTACT
50 Pcs.
Product condition, packaging, certifications and applicable manufacturer warranty terms are confirmed with the quotation.
| Product type | Feed-through header |
| Product family | DFK-MSTBA 2,5/..-GF |
| Product line | COMBICON Connectors M |
| Number of positions | 4 |
| Pitch | 5.08 mm |
| Number of connections | 4 |
| Number of rows | 1 |
| Number of potentials | 4 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 01 |
| Nominal current IN | 12 A |
| Nominal voltage UN | 320 V |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Rated voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
| Flange | |
| Tightening torque | 0.3 Nm |
| Attachment to feed-through panel | |
| Tightening torque | 0.3 Nm |
| Screw | 0708263 DFK-MSTB SS for housing walls of up to 6 mm thick |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | graphite black (9011) |
| Insulating material | PBT |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 225 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing | ![]() |
| Pitch | 5.08 mm |
| Width [w] | 50.08 mm |
| Height [h] | 18.2 mm |
| Length [l] | 12 mm |
| Installed height | 18.2 mm |
| Solder pin length [P] | 3.23 mm |
| Pin dimensions | 1 x 1 mm |
| PCB design | |
| Hole diameter | 1.4 mm |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 225 |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value - non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 4 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value - non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3.2 mm |
| Rated insulation voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value - non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 4 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
| Type of packaging | packed in cardboard |