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SPT 2,5/ 6-H-5,0-EX 1732425 PHOENIX CONTACT PCB terminal block
SPT 2,5/ 6-H-5,0-EX
1732425
PHOENIX CONTACT
50 Pcs.
PCB terminal block
Terminal block for printed circuit board, nominal current: 23 A, nominal section: 2.5 mm², number of potentials: 6, number of rows: 1, number of poles per row: 6, family of articles: SPT 2.5/.. -H-EX, pitch: 5mm, connection type: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: green, Pin arrangement: Linear pin arrangement, Pin length [P]: 2.5mm, number of solder pins per potential: 2, packaging type: boxed
Printed circuit board terminal, nominal current: 23 A, nominal cross section: 2.5 mm2, number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: SPT 2,5/..-H-EX, pitch: 5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 2.5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard
Connectors > Printed circuit board terminal
PCB Connectors (PCC)
Product condition, packaging, certifications and applicable manufacturer warranty terms are confirmed with the quotation.
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SPT 2,5/ 6-H-5,0-EX 1732425 PHOENIX CONTACT PCB terminal block is designed for hazardous area applications requiring certified explosion protection for internal board wiring. Technicians deploy these components to maintain safe circuit integration within industrial automation systems. Pricing, availability and lead time are confirmed per enquiry through an RFQ.
- Product type: Printed circuit board terminal
- Product family: SPT 2,5/..-H-EX
- Product line: COMBICON Terminals M
- Number of positions: 6
- Pitch: 5 mm
- Number of connections: 6
- Number of rows: 1
- Number of potentials: 6
- Pin layout: Linear pinning
- Solder pins per potential: 2
- Data management status Article revision: 03
- Nominal current I N: 23 A
- Nominal voltage U N: 176 V
- Rated current / conductor cross section: 23 A/2.5 mm²
- Ex approval Identification: 0344 II 2GD / Ex eb IIC Gb
- EU-type examination certificate: KEMA 07ATEX0193 U
More info
▲Technical data
Product properties
| Product type | Printed circuit board terminal |
| Product family | SPT 2,5/..-H-EX |
| Product line | COMBICON Terminals M |
| Number of positions | 6 |
| Pitch | 5 mm |
| Number of connections | 6 |
| Number of rows | 1 |
| Number of potentials | 6 |
| Pin layout | Linear pinning |
| Solder pins per potential | 2 |
| Data management status | |
| Article revision | 03 |
Electrical properties
| Nominal current IN | 23 A |
| Nominal voltage UN | 176 V |
| Rated current / conductor cross section | 23 A/2.5 mm² |
Ex data
| Ex approval | |
| Identification | 0344 II 2GD / Ex eb IIC Gb |
| EU-type examination certificate | KEMA 07ATEX0193 U |
| IECEx certificate | IECEx KEM 07.0057 U |
Connection data
| Connection technology | |
| Nominal cross section | 2.5 mm² |
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross section rigid | 0.2 mm² ... 4 mm² |
| Conductor cross section flexible | 0.2 mm² ... 2.5 mm² |
| Conductor cross section AWG | 24 ... 14 |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.25 mm² ... 2.5 mm² (Stripping length 8 mm) |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.25 mm² ... 1.5 mm² (Stripping length 8 mm) |
| Stripping length | 10 mm |
Mounting
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
Material specifications
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | hot-dip tin-plated |
| Metal surface terminal point (top layer) | Tin (4 - 8 µm Sn) |
| Metal surface soldering area (top layer) | Tin (4 - 8 µm Sn) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
Notes
| Note on application | Rated insulation voltage with pitch spacer RZ-SPT 2,5-2,5: 275 V RZ-SPT 2,5-5,0: 440 V |
Dimensions
| Dimensional drawing | |
| Pitch | 5 mm |
| Width [w] | 31.4 mm |
| Height [h] | 16 mm |
| Length [l] | 14.4 mm |
| Installed height | 13.5 mm |
| Solder pin length [P] | 2.5 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| PCB design | |
| Pin spacing | 8.2 mm |
| Hole diameter | 1.2 mm |
Mechanical tests
| Connection test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Test for conductor damage and slackening | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60998-2-2:2002-12 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| 4 mm² / solid / > 60 N | |
| 2.5 mm² / flexible / > 50 N | |
Electrical tests
| Temperature-rise test | |
| Specification | IEC 60998-2-1:2002-12 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Insulation resistance | |
| Specification | IEC 60998-1:2002-12 |
| Insulation resistance, neighboring positions | 109Ω |
Environmental and real-life conditions
| Vibration test | |
| Specification | IEC 60068-2-6:1995-03 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60998-1:2002-12 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Ambient conditions | |
| Ambient temperature (operation) | -50 °C ... 110 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Type of packaging | packed in cardboard |