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IDC 0,3/ 8-3,81 1706235 PHOENIX CONTACT PCB terminal block, Nominal current: 5 A, Nom. voltage: 160 V, Pitch..
IDC 0,3/ 8-3,81
1706235
PHOENIX CONTACT
50 Pcs.
PCB terminal block, Nominal current: 5 A, Nom. voltage: 160 V, Pitch: 3.81 mm, Number of positions: 8, Connection method: Displacement connection, Mounting: Wave soldering, Conductor/PCB connection direction: 0 °, Color: green
Terminal block for printed circuit board, nominal current: 5 A, nominal voltage (III/2): 160 V, nominal cross-section: 0.34 mm², number of potentials: 8, number of rows: 1, number of poles per row: 8, article family: IDC 0.3, pitch: 3.81 mm, connection type: Offset connection, mounting: Wave soldering, conductor connection direction/printed circuit board: 0 °, color: green, Pin arrangement: Linear pin arrangement, Pin length [P]: 3.4 mm, number of welding pins per potential: 1, packaging type: boxed
Printed circuit board terminal, nominal current: 5 A, rated voltage (III/2): 160 V, nominal cross section: 0.34 mm2, number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: IDC 0,3, pitch: 3.81 mm, connection method: Displacement connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.4 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard
Connectors > Printed circuit board terminal
PCB Connectors (PCC)
Product condition, packaging, certifications and applicable manufacturer warranty terms are confirmed with the quotation.
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The Phoenix Contact IDC 0,3/ 8-3,81 PCB terminal block provides efficient insulation displacement technology for quick, stripping-free wire termination on circuit boards. These compact terminal blocks are widely used in sensor arrays, instrumentation, and light industrial electronic devices. Pricing, availability and lead time are confirmed per enquiry through an RFQ.
- Product type: Printed circuit board terminal
- Product family: IDC 0,3
- Product line: COMBICON Terminals XS
- Type: PC termination block
- Number of positions: 8
- Pitch: 3.81 mm
- Number of connections: 8
- Number of rows: 1
- Number of potentials: 8
- Pin layout: Linear pinning
- Solder pins per potential: 1
- Data management status Article revision: 01
- Nominal current I N: 5 A
- Nominal voltage U N: 160 V
- Rated voltage (III/3): 160 V
- Rated surge voltage (III/3): 2.5 kV
More info
▲Technical data
Product properties
| Product type | Printed circuit board terminal |
| Product family | IDC 0,3 |
| Product line | COMBICON Terminals XS |
| Type | PC termination block |
| Number of positions | 8 |
| Pitch | 3.81 mm |
| Number of connections | 8 |
| Number of rows | 1 |
| Number of potentials | 8 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 01 |
Electrical properties
| Nominal current IN | 5 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
Connection data
| Connection technology | |
| Type | PC termination block |
| Nominal cross section | 0.34 mm² |
| Conductor connection | |
| Connection method | Displacement connection |
| Conductor cross section rigid | 0.13 mm² ... 0.34 mm² |
| Conductor cross section flexible | 0.22 mm² ... 0.34 mm² |
| Conductor cross section AWG | 26 ... 22 |
Mounting
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
Material specifications
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (2 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Material data – actuating element | |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
Dimensions
| Dimensional drawing | |
| Pitch | 3.81 mm |
| Width [w] | 31.67 mm |
| Height [h] | 22.2 mm |
| Length [l] | 12.4 mm |
| Installed height | 18.8 mm |
| Solder pin length [P] | 3.4 mm |
| Pin dimensions | 1 x 0.4 mm |
| PCB design | |
| Hole diameter | 1.3 mm |
Electrical tests
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.5 mm |
| Rated insulation voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.6 mm |
Environmental and real-life conditions
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Type of packaging | packed in cardboard |