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FK-MPT 0,5/ 8-3,5 1891124 PHOENIX CONTACT PCB terminal block
FK-MPT 0,5/ 8-3,5
1891124
PHOENIX CONTACT
50 Pcs.
PCB terminal block
Terminal block for printed circuit board, nominal current: 4 A, nominal voltage (III/2): 250 V, nominal section: 0.5 mm², number of potentials: 8, number of rows: 1, number of poles per row: 8, family of articles: FK-MPT 0.5/.. -V, pitch: 3.5 mm, connection type: Push-in spring connection, mounting: Wave soldering, conductor/printed circuit board connection direction: 90 °, color: green, Pin arrangement: Linear pin arrangement, Pin length [P]: 3.5 mm, number of solder pins per potential: 1, packaging type: boxed
Printed circuit board terminal, nominal current: 4 A, rated voltage (III/2): 250 V, nominal cross section: 0.5 mm2, number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: FK-MPT 0,5/..-V, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard
Connectors > Printed circuit board terminal
PCB Connectors (PCC)
Product condition, packaging, certifications and applicable manufacturer warranty terms are confirmed with the quotation.
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Phoenix Contact FK-MPT 0,5/ 8-3,5 PCB terminal block facilitates dependable electrical connections directly onto printed circuit boards. Engineers deploy these components in compact electronic devices to streamline internal cable routing and maintain steady signal integrity. Pricing, availability and lead time are confirmed per enquiry through an RFQ.
- Product type: Printed circuit board terminal
- Product family: FK-MPT 0,5/..-V
- Product line: COMBICON Terminals XS
- Type: PC termination block
- Number of positions: 8
- Pitch: 3.5 mm
- Number of connections: 16
- Number of rows: 1
- Number of potentials: 8
- Mounting flange: without
- Pin layout: Linear pinning
- Solder pins per potential: 1
- Data management status Article revision: 02
- Nominal current I N: 4 A
- Nominal voltage U N: 250 V
- Rated voltage (III/3): 160 V
More info
▲Technical data
Product properties
| Product type | Printed circuit board terminal |
| Product family | FK-MPT 0,5/..-V |
| Product line | COMBICON Terminals XS |
| Type | PC termination block |
| Number of positions | 8 |
| Pitch | 3.5 mm |
| Number of connections | 16 |
| Number of rows | 1 |
| Number of potentials | 8 |
| Mounting flange | without |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 02 |
Electrical properties
| Nominal current IN | 4 A |
| Nominal voltage UN | 250 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 250 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
Connection data
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross section rigid | 0.12 mm² ... 0.5 mm² |
| Conductor cross section AWG | 26 ... 20 |
| Stripping length | 6.5 mm |
Mounting
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
Material specifications
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Steel/copper |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface terminal point (middle layer) | Copper (2 - 3 µm Cu) |
| Metal surface soldering area (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface soldering area (middle layer) | Copper (2 - 3 µm Cu) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | PBT |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 225 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color (Actuating element) | orange (2003) |
| Insulating material | POM |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | HB |
Dimensions
| Dimensional drawing | |
| Pitch | 3.5 mm |
| Width [w] | 28.5 mm |
| Height [h] | 13 mm |
| Length [l] | 7 mm |
| Installed height | 9.5 mm |
| Solder pin length [P] | 3.5 mm |
| Pin dimensions | 0.35 x 0.9 mm |
| PCB design | |
| Hole diameter | 1 mm |
Mechanical tests
| Test for conductor damage and slackening | |
| Specification | IEC 60999-1:1990-05 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60999-1:1990-05 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.14 mm² / solid / > 10 N |
| 0.5 mm² / solid / > 30 N | |
Electrical tests
| Temperature-rise test | |
| Specification | IEC 60998-1:1990-04 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Insulation resistance | |
| Specification | IEC 60512-2:1985-00 |
| Insulation resistance, neighboring positions | 1012Ω |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 225 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 250 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 2.5 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
Environmental and real-life conditions
| Vibration test | |
| Specification | IEC 60068-2-6:1995-03 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Type of packaging | packed in cardboard |