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CCVA 2,5/22-G-5,08 P26THR 1827977 PHOENIX CONTACT Printed-circuit board connector
CCVA 2,5/22-G-5,08 P26THR
1827977
PHOENIX CONTACT
52 Pcs.
Printed-circuit board connector
Printed circuit board base housing, nominal section: 2.5 mm², color: black, nominal current: 12 A, nominal voltage (III/2): 320 V, contact surface: Tin, contact type: Male, number of potentials: 22, number of rows: 1, number of poles: 22, number of connections: 22, family of articles: CCVA 2.5/.. -G, pitch: 5.08 mm, mounting: Solder THR, pin arrangement: Linear pin arrangement, pin length [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2.5, Plug-in face orientation: Standard, locking: without, fixing type: without, packaging type: boxed
PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 22, number of rows: 1, number of positions: 22, number of connections: 22, product range: CCVA 2,5/..-G, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
Connectors > Printed circuit board connector
PCB Connectors (PCC)
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A CCVA 2,5/22-G-5,08 P26THR printed-circuit board connector from Phoenix Contact features a high-position pin configuration suitable for automated surface mounting in large-scale control systems. It provides an extensive array of connection points for orderly signal and power distribution on electronics boards. Pricing, availability and lead time are confirmed per enquiry through an RFQ.
- Product type: PCB headers
- Product family: CCVA 2,5/..-G
- Product line: COMBICON Connectors M
- Type: Component suitable for through hole reflow
- Number of positions: 22
- Pitch: 5.08 mm
- Number of connections: 22
- Number of rows: 1
- Number of potentials: 22
- Mounting flange: without
- Pin layout: Linear pinning
- Solder pins per potential: 1
- Data management status Article revision: 01
- Nominal current I N: 12 A
- Nominal voltage U N: 320 V
- Contact resistance: 1.3 mΩ
More info
▲Technical data
Product properties
| Product type | PCB headers |
| Product family | CCVA 2,5/..-G |
| Product line | COMBICON Connectors M |
| Type | Component suitable for through hole reflow |
| Number of positions | 22 |
| Pitch | 5.08 mm |
| Number of connections | 22 |
| Number of rows | 1 |
| Number of potentials | 22 |
| Mounting flange | without |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 01 |
Electrical properties
| Nominal current IN | 12 A |
| Nominal voltage UN | 320 V |
| Contact resistance | 1.3 mΩ |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| Rated voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
Mounting
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
Material specifications
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
Notes
| Details for soldering processes | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
Dimensions
| Dimensional drawing | |
| Pitch | 5.08 mm |
| Width [w] | 114.56 mm |
| Height [h] | 14.6 mm |
| Length [l] | 8.6 mm |
| Installed height | 12 mm |
| Solder pin length [P] | 2.6 mm |
| Pin dimensions | 1 x 1 mm |
| PCB design | |
| Hole diameter | 1.6 mm |
Mechanical tests
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N | Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 8 N |
| Withdraw strength per pos. approx. | 6 N |
Electrical tests
| Thermal test Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 24 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value - non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 4 mm |
| Rated insulation voltage (III/2) | 320 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value - non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3.2 mm |
| Rated insulation voltage (II/2) | 400 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value - non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 4 mm |
Environmental and real-life conditions
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 4.8 kV |
| Contact resistance R1 | 1.3 mΩ |
| Contact resistance R2 | 1.4 mΩ |
| Insertion/withdrawal cycles | 25 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Climatic test | |
| Specification | ISO 6988:1985-02 |
| Corrosive stress | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
| Thermal stress | 100 °C/168 h |
| Power-frequency withstand voltage | 2.21 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Type of packaging | packed in cardboard |